Smaller, More Cost-Efficient, Flexible—and Proven

Imbera's patented process seamlessly combines the know-how and processes of printed circuit board manufacturing, component packaging and component assembly.

In contrast to conventional surface mount technology where the packaged components are mounted on top of a pre-manufactured PCB using traditional soldering technology, Imbera's patented IMB technology embeds the components inside the substrate and the PCB is built around the components afterwards.

This gives you a number of important benefits.


Miniaturization

With Imbera's patented IMB technology, components can be embedded inside the PCB, reducing the product volume and enabling advanced structures in small size. With a great freedom of design, the technology is enabler of decreased end product volume. Miniaturization may be achieved in both x-y and z-directions.


High electrical performance

Short, metallurgical interconnections make the patented IMB technology the ideal choice for high-frequency applications, with minimal distortion in the signal phase due to reduced parasitics. IMB technology enables the manufacture of an embedded EMI shield with high-level isolation from both capacitively and inductively coupled noise over a wide frequency range. In this way, you can dispense with an additional surface mounted shield around the component or module.


Design flexibility

Imbera's patented technology gives unparalleled design flexibility, since the component is located in between the PCB conductor layers instead of on top of the PCB. Also, interconnections can be created on both sides of the component, enabling the use of the rear side either for the signal, ground or thermal contact. In addition, individual components can be encased in integrated EMI shields, which enable components normally interfering with one another to be embedded in the same module.

Since components are embedded inside the PCB rather than on top of it, the surface is freed up for standard routing - for example, the manufacture of advanced package-on-package (POP) modules with full array solder lands is feasible.

One of the greatest benefits of Imbera's proprietary technology is the improvement of routing capability. IMB designs are simpler and ss fewer routing layers are usually needed and even the innermost layer can efficiently used for routing, the yield can be significantly improved.


High applicability

Already proven in handheld consumer electronics and telecom applications, Imbera's patented technology is adaptable to almost any electronic product, from simple single component modules to highly advanced 3D structures.

Cost-efficient manufacturing

Standard high-volume manufacturing equipment and commercially available materials can be used in the patented IMB manufacturing process. Thus, with extensive supply base and robust processes we can provide embedded solution with good total cost of ownership.


High yield

Imbera's process yield is extremely high. To ensure high final yield all the way through the PCB process, we only use highly competent and sophisticated PCB processes.


Novel thermal management

IMB technology offers various methods of thermal management. Several types of heat conducting structures can be manufactured with no additional process steps to decrease the temperature gradient between the IC and other parts of the electronic package. Thermal via matrices or other thermal structures can be in direct contact with the front or rear side of the component, conducting the heat directly away from the IC or hot spot. In addition, copper planes or grids on the PCB surface, with optimized geometry, can be used to improve heat conductivity and spread the heat to the edges of the module and to the motherboard.


Conforming to sustainable development

Since IMB technology utilizes existing materials, you can easily use e.g. environmentally friendly materials, for example such that meet RoHS directive requirements. Also, the IMB manufacturing process is solderless and the end products are compatible with lead-free soldering processes. Since the overall manufacturing process is shorter and manufacturing is performed in one place, the environmental load is smaller than in traditional packaging processes.


Variable component thickness acceptable

Unlike some other technologies, Imbera's patented IMB technology enables, that component thicknesses within one module may be different. For example 500 µm difference is feasible. The core that is built around the components is not affected by varying component size. The thickness is chosen by the thickest component. Thus, you can have different types of components embedded in one module.


Maturity already achieved

Imbera's technology is the most capable for manufacturing embedded solutions while at the same time providing genuine cost effectiveness. The manufacturing facility iDD – Imbera Daeduck Corporation - is the World’s first facility dedicated to component embedding manufacturing.


In a nutshell, all this means cost-effective miniaturization in high quality and with excellent yield.