Smaller, More Cost-Efficient, Flexible—and Proven
Imbera's patented process seamlessly combines the know-how and processes of
printed circuit board manufacturing, component packaging and component
In contrast to conventional surface mount technology where the packaged
components are mounted on top of a pre-manufactured PCB using traditional
soldering technology, Imbera's patented IMB technology embeds the
components inside the substrate and the PCB is built around the components
This gives you a number of important benefits.
With Imbera's patented IMB technology, components can be embedded inside
the PCB, reducing the product volume and enabling advanced structures in
small size. With a great freedom of design, the technology is enabler of
decreased end product volume. Miniaturization may be achieved in both x-y
High electrical performance
Short, metallurgical interconnections make the patented IMB technology the
ideal choice for high-frequency applications, with minimal distortion in
the signal phase due to reduced parasitics. IMB technology enables the
manufacture of an embedded EMI shield with high-level isolation from both
capacitively and inductively coupled noise over a wide frequency range. In
this way, you can dispense with an additional surface mounted shield around
the component or module.
Imbera's patented technology gives unparalleled design flexibility, since
the component is located in between the PCB conductor layers instead of
on top of the PCB. Also, interconnections can be created on both sides of
the component, enabling the use of the rear side either for the signal,
ground or thermal contact. In addition, individual components can be
encased in integrated EMI shields, which enable components normally
interfering with one another to be embedded in the same module.
Since components are embedded inside the PCB rather than on top of it, the
surface is freed up for standard routing - for example, the manufacture of
advanced package-on-package (POP) modules with full array solder lands is
One of the greatest benefits of Imbera's proprietary technology is the
improvement of routing capability. IMB designs are simpler and ss fewer
routing layers are usually needed and even the innermost layer can
efficiently used for routing, the yield can be significantly improved.
Already proven in handheld consumer electronics and telecom applications,
Imbera's patented technology is adaptable to almost any electronic
product, from simple single component modules to highly advanced 3D
Standard high-volume manufacturing equipment and commercially available
materials can be used in the patented IMB manufacturing process. Thus,
with extensive supply base and robust processes we can provide embedded
solution with good total cost of ownership.
Imbera's process yield is extremely high. To ensure high final yield all
the way through the PCB process, we only use highly competent and
sophisticated PCB processes.
Novel thermal management
IMB technology offers various methods of thermal management. Several types
of heat conducting structures can be manufactured with no additional
process steps to decrease the temperature gradient between the IC and
other parts of the electronic package. Thermal via matrices or other
thermal structures can be in direct contact with the front or rear side of
the component, conducting the heat directly away from the IC or hot spot.
In addition, copper planes or grids on the PCB surface, with optimized
geometry, can be used to improve heat conductivity and spread the heat to
the edges of the module and to the motherboard.
Conforming to sustainable development
Since IMB technology utilizes existing materials, you can easily use e.g.
environmentally friendly materials, for example such that meet RoHS
directive requirements. Also, the IMB manufacturing process is solderless
and the end products are compatible with lead-free soldering processes.
Since the overall manufacturing process is shorter and manufacturing is
performed in one place, the environmental load is smaller than in
traditional packaging processes.
Variable component thickness acceptable
Unlike some other technologies, Imbera's patented IMB technology enables,
that component thicknesses within one module may be different. For example
500 µm difference is feasible. The core that is built around the components
is not affected by varying component size. The thickness is chosen by the
thickest component. Thus, you can have different types of components
embedded in one module.
Maturity already achieved
Imbera's technology is the most capable for manufacturing embedded
solutions while at the same time providing genuine cost effectiveness. The
manufacturing facility iDD – Imbera Daeduck Corporation - is the World’s
first facility dedicated to component embedding manufacturing.
In a nutshell, all this means cost-effective miniaturization in high
quality and with excellent yield.