How to improve the product by embedding passive components?
Embedding part of the passive components inside the PCB core enables new
functions in the product! Surface space savings, more cost-effective final
assembly, PCB with lower wiring density and improved electrical
performance. Contact Imbera to find out the embedding advantages in your
product!
The challenge you as an electronics manufacturer face is: how to make
products smaller, but at the same time provide better electrical
performance and functionality. All of these requirements are included in
Imberas technology roadmap.
Imbera improves total cost of
ownership
Unlike traditional surface mount technology (SMT), in Imbera's patented
technology the components are embedded inside an organic substrate. Many
kinds of components can be embedded: bare dies (Silicon, GaAs), discrete
passive components, application specific integrated passive (ASIP)
components, and wafer level CSPs. The manufacturing process combines PCB
manufacturing, component packaging and component assembly into a single
manufacturing sequence, thereby making production simple while providing a
very good total cost of ownership.
Imbera improves performance
The advanced manufacturing process enables us to embed either a
complete product or part of the components inside the substrate. This not
only makes the package up to 40% smaller, but also improves its electrical
properties as the signal paths are shorter than if components were mounted
on top of the board. The thermal properties of an embedded, compact
package can be excellently managed through design.
Imbera's novel, advanced patented process can be used for manufacturing
either System-In-Package (SIP) or System-In-Board (SIB) type applications.
The technology is well suited for a wide range of low to mid-high pin count
applications: simple products with only a few components as well as
demanding products like mobile phones and other portable, personal
products that require high packaging density and good electrical
performance.
What is System-In-Package
(SIP)?
In SIP modules, either a complete functional system or a subsystem is
integrated into a standard or customized module. A typical SIP module
contains one or more integrated circuits, plus passive and other
components. This module is used like a standard component and mounted on
top of a motherboard.
What is System-In-Board
(SIB)?
In SIB modules, the complete product or system, including numerous
passive and active components, is integrated inside the motherboard. Such
modules are typically used as motherboards for the rest of the
components.
