How to improve the product by embedding?
Depending on the product, improved electrical and thermal properties, size
reduction of up to 40% and other enhancements can typically be achieved.
Why consider embedding for the product that is already designed into a
SiP package?
Embedding one of the dies and/or some passive components may enable a new
die or more passive components to be included in the same (or even
smaller) package outline giving your customer a more attractive solution.
Why consider embedding for a single die solution?
Imbera’s iBGA is an answer to the demand for fanning out I/Os from a die
area to increase package pitch or I/O count in a cost effective manner.
E.g. increasing the I/O count for an area-constrained WLCSP.
The iQFN package provides flexible routing and footprint options for your
QFN style package.
Imbera’s iSiP is an excellent solution for higher levels of module
integration. E.g. by embedding an IC and mounting the passives from the
mother board reference design on top, the functionality of the product is
guaranteed. At the same time your customer benefits from a reduced
end-product footprint.
How to improve the product by embedding passive components in the
mother board?
Embedding some of the passive components inside the PCB core can enable
new functions in the product. Imbera’s SiB solutions offer surface space
savings, more cost-effective final assembly, PCB with lower wiring density
and improved electrical performance.
Imbera improves total cost of
ownership
Unlike traditional surface mount technology (SMT), in Imbera's patented
technology the components are embedded inside an organic substrate. Many
kinds of components can be embedded: bare dies (Silicon, GaAs), discrete
passive components, application specific integrated passive (ASIP)
components, and wafer level CSPs. The manufacturing process combines PCB
manufacturing, component packaging and component assembly into a single
manufacturing sequence, thereby making production simple while providing a
very good total cost of ownership.
Imbera improves performance
The advanced manufacturing process enables us to embed either a
complete product or part of the components inside the substrate. This not
only makes the package up to 40% smaller, but also improves its electrical
properties as the signal paths are shorter than if components were mounted
on top of the board. The thermal properties of an embedded, compact
package can be excellently managed through design.
Imbera's novel, advanced patented process can be used for manufacturing
either System-In-Package (SIP) or System-In-Board (SIB) type applications.
The technology is well suited for a wide range of low to mid-high pin count
applications: simple products with only a few components as well as
demanding products like mobile phones and other portable, personal
products that require high packaging density and good electrical
performance.
What is System-In-Package
(SIP)?
In SIP modules, either a complete functional system or a subsystem is
integrated into a standard or customized module. A typical SIP module
contains one or more integrated circuits, plus passive and other
components. This module is used like a standard component and mounted on
top of a motherboard.
What is System-In-Board
(SIB)?
In SIB modules, the complete product or system, including numerous
passive and active components, is integrated inside the motherboard. Such
modules are typically used as motherboards for the rest of the
components.
