Imbera's technology can be utilized across a broad range of electronics
packaging and manufacturing, from simple products containing only a few
passives or one active component to highly advanced modules containing
several passive and active components.
Single IC packages
The single IC package family consists of two package types – iQFN and
iBGA. Characteristic of these packages are one embedded component (from
low to medium I/O count) and conductor layers on only one side of the
Many types of package fall within the IMB SiP module category. The
embedding might be applied to only one component, which provides an
advanced substrate for other components on top of it (e.g. the bottom
package in PoP structure or advanced substrate for wire-bonded ICs), or
several active and/or passives can be embedded in single or multiple
Discrete passive components, IPDs and low to medium I/O count active
components can be embedded in a motherboard to achieve e.g.
miniaturization or improved electrical performance.
Contact us to evaluate improvements in your
For more information, you can also contact the nearest sales office. If you are interested in seeing
how the evaluation process might be carried out, learn more about services.